Alpha Lead Free Solder Paste, 500g Tub

RS Stock No.: 132-699Brand: AlphaManufacturers Part No.: OM350
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Technical Document

Specifications

Brand

Alpha

Lead Free

Yes

Package Type

Tub

Package Size

500g

Product details

OM-350(low Silver) Lead Free Solder Paste

Lead free, no-clean solder paste suitable for fine feature screen printing and reflow using the most demanding soak reflow profiles in air or nitrogen atmospheres. The outstanding reflow process window delivers good soldering on all popular lead free surface finishes. Compliance with Bellcore & JIS reliability testing as well as IPC Class III voiding classifications ensures maximum long-term product reliability.

Contains Alpha SACX® alloy (99% Tin, 0.3% Silver, 0.7% Copper)
Suitable for Pin- in-Paste (Intrusive Reflow)
Wide lead free reflow profile window
Excellent solder joint and flux residue cosmetics
Stable paste viscosity ensuring repeatable printing
High tack and SIR, halide free material
Compatible with SM-110 Stencil Wipes

Standards

ROL0 Designation to ANSI/J-STD-004

Solder Paste - Lead Free

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P.O.A.

Alpha Lead Free Solder Paste, 500g Tub

1

Available in multiples of 1
1P.O.A.
2P.O.A.
3P.O.A.
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5P.O.A.
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Imported by:

RS Components & Controls (I) Ltd

Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301

P.O.A.

Alpha Lead Free Solder Paste, 500g Tub
Stock information temporarily unavailable.

1

Available in multiples of 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.
You may be interested in

Technical Document

Specifications

Brand

Alpha

Lead Free

Yes

Package Type

Tub

Package Size

500g

Product details

OM-350(low Silver) Lead Free Solder Paste

Lead free, no-clean solder paste suitable for fine feature screen printing and reflow using the most demanding soak reflow profiles in air or nitrogen atmospheres. The outstanding reflow process window delivers good soldering on all popular lead free surface finishes. Compliance with Bellcore & JIS reliability testing as well as IPC Class III voiding classifications ensures maximum long-term product reliability.

Contains Alpha SACX® alloy (99% Tin, 0.3% Silver, 0.7% Copper)
Suitable for Pin- in-Paste (Intrusive Reflow)
Wide lead free reflow profile window
Excellent solder joint and flux residue cosmetics
Stable paste viscosity ensuring repeatable printing
High tack and SIR, halide free material
Compatible with SM-110 Stencil Wipes

Standards

ROL0 Designation to ANSI/J-STD-004

Solder Paste - Lead Free

You may be interested in