TE Connectivity Backplane Connector Through Hole, 4, 250V 10A
Technical Document
Specifications
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Stock information temporarily unavailable.
₹ 45,869.82
₹ 997.17 Each (In a Tube of 46) (Exc. GST)
₹ 54,126.39
₹ 1,176.661 Each (In a Tube of 46) (inc. GST)
46
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
₹ 45,869.82
₹ 997.17 Each (In a Tube of 46) (Exc. GST)
₹ 54,126.39
₹ 1,176.661 Each (In a Tube of 46) (inc. GST)
Stock information temporarily unavailable.
46
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products