Technical Document
Specifications
Brand
TE ConnectivityNumber of Contacts
10
Product Type
PCB Socket
Number of Rows
2
Sub Type
Socket Strip
Pitch
1.27mm
Current
12A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
30 V
Series
AMPMODU System 50
Minimum Operating Temperature
-40°C
Row Pitch
2.54mm
Contact Gender
Female
Maximum Operating Temperature
105°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Product details
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.
Stock information temporarily unavailable.
P.O.A.
Standard
1
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
P.O.A.
Stock information temporarily unavailable.
Standard
1
Technical Document
Specifications
Brand
TE ConnectivityNumber of Contacts
10
Product Type
PCB Socket
Number of Rows
2
Sub Type
Socket Strip
Pitch
1.27mm
Current
12A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
30 V
Series
AMPMODU System 50
Minimum Operating Temperature
-40°C
Row Pitch
2.54mm
Contact Gender
Female
Maximum Operating Temperature
105°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Product details
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.


