Technical Documents
Specifications
Brand
SamtecProduct Type
PCB Header
Series
ERM8
Pitch
0.8mm
Current
1.4A
Number of Contacts
80
Housing Material
Liquid Crystal Polymer
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
0.8mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Voltage
318V
Product Details
The Samtec ERM8 0.80 mm is a board-mounted header designed for use in high-speed system. The ERM8 uses the Edge rate contact system which is designed for application requiring high-mating cycle and 56Gbps PAM4 performance. It have 0.25 μm gold plating con
Stock information temporarily unavailable.
₹ 223,217.50
₹ 892.87 Each (On a Reel of 250) (Exc. GST)
₹ 263,396.65
₹ 1,053.587 Each (On a Reel of 250) (inc. GST)
250
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
₹ 223,217.50
₹ 892.87 Each (On a Reel of 250) (Exc. GST)
₹ 263,396.65
₹ 1,053.587 Each (On a Reel of 250) (inc. GST)
Stock information temporarily unavailable.
250
| Quantity | Unit price | Per Reel |
|---|---|---|
| 250 - 250 | ₹ 892.87 | ₹ 223,217.50 |
| 500 - 750 | ₹ 833.01 | ₹ 208,252.50 |
| 1000+ | ₹ 806.27 | ₹ 201,567.50 |
Technical Documents
Specifications
Brand
SamtecProduct Type
PCB Header
Series
ERM8
Pitch
0.8mm
Current
1.4A
Number of Contacts
80
Housing Material
Liquid Crystal Polymer
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
0.8mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Voltage
318V
Product Details
The Samtec ERM8 0.80 mm is a board-mounted header designed for use in high-speed system. The ERM8 uses the Edge rate contact system which is designed for application requiring high-mating cycle and 56Gbps PAM4 performance. It have 0.25 μm gold plating con