Loctite Loctite HF212 97SC DAP Lead Free Solder Paste, 500g Tub
Technical Document
Specifications
Product details
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies
Solder Paste - Lead Free
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₹ 11,731.90
Each (Exc. GST)
₹ 13,843.64
Each (inc. GST)
1
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
₹ 11,731.90
Each (Exc. GST)
₹ 13,843.64
Each (inc. GST)
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 9 | ₹ 11,731.90 |
| 10 - 19 | ₹ 11,249.77 |
| 20 - 49 | ₹ 10,949.77 |
| 50+ | ₹ 10,665.36 |
Technical Document
Specifications
Product details
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies