Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
1608-09
Equivalent Series Resistance
500mΩ
Tolerance
±20%
Length
1.6mm
Depth
0.8mm
Maximum Operating Temperature
+105°C
Height
0.8mm
Dimensions
1.6 x 0.8 x 0.8mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
10 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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P.O.A.
4000
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
![sticker-1112](https://cms.rsdelivers.com/repository-v1/MPQ2.jpg)
P.O.A.
4000
![sticker-1112](https://cms.rsdelivers.com/repository-v1/MPQ2.jpg)
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
1608-09
Equivalent Series Resistance
500mΩ
Tolerance
±20%
Length
1.6mm
Depth
0.8mm
Maximum Operating Temperature
+105°C
Height
0.8mm
Dimensions
1.6 x 0.8 x 0.8mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
10 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets