Technical Document
Specifications
Brand
BergquistDimensions
200 x 100mm
Thickness
0.06in
Length
200mm
Width
100mm
Thermal Conductivity
0.9W/m·K
Material
Polymer
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 40
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating
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P.O.A.
1
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
P.O.A.
1
Technical Document
Specifications
Brand
BergquistDimensions
200 x 100mm
Thickness
0.06in
Length
200mm
Width
100mm
Thermal Conductivity
0.9W/m·K
Material
Polymer
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 40
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating