Technical Document
Specifications
Brand
WinslowNumber Of Contacts
14
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
17.7mm
Width
3.5mm
Depth
10.14mm
Dimensions
17.7 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
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Please check again later.
₹ 56.04
Each (In a Tube of 28) (Exc. GST)
₹ 66.127
Each (In a Tube of 28) (inc. GST)
28
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
₹ 56.04
Each (In a Tube of 28) (Exc. GST)
₹ 66.127
Each (In a Tube of 28) (inc. GST)
28
Buy in bulk
quantity | Unit price | Per Tube |
---|---|---|
28 - 672 | ₹ 56.04 | ₹ 1,569.12 |
700 - 2072 | ₹ 53.74 | ₹ 1,504.72 |
2100 - 5572 | ₹ 52.31 | ₹ 1,464.68 |
5600 - 11172 | ₹ 50.95 | ₹ 1,426.60 |
11200+ | ₹ 49.66 | ₹ 1,390.48 |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
14
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
17.7mm
Width
3.5mm
Depth
10.14mm
Dimensions
17.7 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).