Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
220µF
Dielectric Material Family
Tantalum
Voltage
6.3V dc
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Height
1.9mm
Maximum Operating Temperature
+105°C
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
138.6 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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₹ 52.15
Each (On a Reel of 2000) (Exc. GST)
₹ 61.537
Each (On a Reel of 2000) (Including GST)
2000
RS Components & Controls (I) Ltd
Distribution hub - B-89, Sector 67, Noida, Gautam Budh Nagar, (Uttar Pradesh), 201 301
₹ 52.15
Each (On a Reel of 2000) (Exc. GST)
₹ 61.537
Each (On a Reel of 2000) (Including GST)
2000
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
220µF
Dielectric Material Family
Tantalum
Voltage
6.3V dc
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Height
1.9mm
Maximum Operating Temperature
+105°C
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
138.6 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets